Renesas Electronics : Announces Development of Next-Generation Wireless MCUs Supporting New Bluetooth® 5.3 Low Energy Specification

TOKYO, Japan – Renesas Electronics Corporation (TSE: 6723), a leading provider of advanced semiconductor solutions, today announced that it is developing new microcontrollers (MCUs) that will support the recently released Bluetooth^® 5.3 Low Energy Specification (LE). The new devices will be part of Renesas Advanced’s (RA) family of 32-bit Arm® Cortex®-M microcontrollers, joining RA4W1 The Bluetooth 5.0 LE device introduced last year. Renesas expects to have the first samples of the new MCUs in the first quarter of 2022.

The new Bluetooth 5.3 specification was released on July 13, 2021. It includes important new features, such as allowing receivers to filter messages without including the host stack to improve the receiver’s lifecycle. It also allows peripherals to provide preferred channels to a central device to improve performance and reliability. In addition, it adds tidy connections that improve the switching time between low and high duty cycle connections for applications that need to switch to fast traffic from time to time. In addition to these features, the directional feature introduced in Bluetooth 5.1, as well as the isochronous channels added in Bluetooth 5.2 for stereo audio transmission, will be supported in Renesas’ new MCUs. The inclusion of software-defined radio (SDR) capabilities will allow customers to later migrate to new versions of the specifications.

Renesas has a long history of Bluetooth development and deep experience in designing Bluetooth LE devices. The new products will be supported by the Flexible Software Package (RA family) for easy application development and Renesas QE for Bluetooth LE plug-in, special Bluetooth profile and application development support tool. The The RA family High security and security mechanisms, including TrustZone support, are also part of these new products.

“We are committed to providing the best performance, ease of use and the latest features on the market.” said Roger Wendelken, senior vice president of Internet of Things and Infrastructure at Renesas. “By offering early, stable support for the Bluetooth 5.3 LE specification, we will enable our RA customers to be the first on the market with their next-generation products.”

Renesas is gearing up to offer a number of winning combinations, including the new Bluetooth 5.3 LE MCU, along with additional analog, power and sync devices. Profitable combinations provide an easy-to-use architecture, simplify the design process and significantly reduce design risk for customers in a wide variety of applications.

Availability

The new MCUs are developed using an advanced manufacturing process that will allow high performance, low power consumption and small package options. Samples are expected to be available in the first quarter of 2022. Read the blog post What’s new in Bluetooth^® 5.3 Low energy for more information on the Bluetooth 5.3 LE specification.

For Renesas Electronics Corporation

Renesas Electronics Corporation (COM)TSE: 6723) offers reliable innovations in embedded design with complete semiconductor solutions that allow billions of connected, smart devices to improve the way people work and live. A global A leader in microcontrollers, analog, power and SoC products, Renesas provides complete solutions for a wide range of automotive, industrial, infrastructure and IoT applications that help shape the unlimited future. Learn more at renesas.com. Follow us in LinkedIn,, Facebook,, Twitter,, YouTube and Instagram.

(Notes). Bluetooth is a registered trademark of Bluetooth SIG, Inc. Arm, Arm Cortex and Arm TrustZone are trademarks or registered trademarks of Arm Limited in the EU and other countries. All product or service names mentioned in this press release are trademarks or registered trademarks of their respective owners.

The content of the press release, including but not limited to prices and product specifications, is based on the information as of the date specified in the document, but is subject to change without notice.