Renesas Announces Development of Next-Generation Wireless MCUs Supporting New Bluetooth® 5.3 Low Energy Specification
TOKYO – (BUSINESS WIRE) – Renesas Electronics Corporation (TSE: 6723), a leading provider of advanced semiconductor solutions, today announced that it is developing new microcontrollers (MCUs) that will support the recently released Bluetooth® 5.3 Low Energy Specification (LE). The new devices will be part of the Renesas Advanced (RA) family of 32-bit Arm® Cortex®-M microcontrollers, joining RA4W1 Bluetooth 5.0 LE device introduced last year. Renesas expects to have the first samples of the new MCUs in the first quarter of 2022.
The new Bluetooth 5.3 specification was released on July 13, 2021. It includes important new features, such as allowing recipients to filter messages without including a host stack to improve receiver lifecycle. It also allows peripherals to provide preferred channels to a central device to improve throughput and reliability. In addition, it adds sub-rated connections, which improve the switching time between low-load and high-load connections for applications that sometimes need to switch to packet traffic. In addition to these features, the directional functionality introduced in Bluetooth 5.1, as well as the isochronous channels added in Bluetooth 5.2 for stereo audio transmission, will be supported in the new Renesas MCUs. The inclusion of software-defined radio (SDR) capabilities will allow customers to later migrate to new versions of the specifications.
Renesas has a long history in Bluetooth development and deep experience in designing Bluetooth LE devices. The new products will be supported by the flexible software package (FSP) of the RA family for easy application development and the Renesas QE add-on for Bluetooth LE, a special Bluetooth profile and application development support tool. IN RA family A high level of security and security mechanisms, including TrustZone support, is also part of these new products.
“We are committed to providing the best performance, ease of use and latest features on the market,” said Roger Wendelken, Senior Vice President, Renesas IoT and Business Infrastructure. “By offering early, stable support for the Bluetooth 5.3 LE specification, we will allow our RA customers to be the first on the market with their next-generation products.
Renesas is gearing up to offer a number of winning combinations, including the new Bluetooth 5.3 LE MCU, along with additional analog, power and sync devices. Profitable combinations provide an easy-to-use architecture, simplifying the design process and significantly reducing design risk for customers in a wide variety of applications.
The new MCUs are developed using an advanced manufacturing process that will enable high performance, low power consumption and options for small packages. Samples are expected to be available in the first quarter of 2022. Read the blog post What’s new in Bluetooth® 5.3 Low energy for more information on the Bluetooth 5.3 LE specification.
About Renesas Electronics Corporation
Renesas Electronics Corporation (COM)TSE: 6723) provides reliable inline design innovation with complete semiconductor solutions that allow billions of connected, smart devices to improve the way people work and live. A global A leader in microcontrollers, analog, power and SoC products, Renesas provides complete solutions for a wide range of automotive, industrial, infrastructure and IoT applications that help shape the unlimited future. Learn more at renesas.com. Follow us in LinkedIn,, Facebook,, Twitter,, YouTube, and Instagram.
(Notes). Bluetooth is a registered trademark of Bluetooth SIG, Inc. Arm, Arm Cortex and Arm TrustZone are trademarks or registered trademarks of Arm Limited in the EU and other countries. All product or service names mentioned in this press release are trademarks or registered trademarks of their respective owners.