Week In Review: Design, Low Power
IP arteries plans to become a public company. He has applied for SEC registration for an IPO and intends to join the Nasdaq. The number of shares offered and the price range of the proposed offer have not yet been determined. Arteris IP provides IP for network connection on a chip, coherent interconnection in cache, and packets to accelerate functional security certification along with IP deployment software.
Qualcomm won in your acquisition offer Veneer. The deal concluded with the investor SSW Partners, offered $ 37.00 per share in cash to Veoneer, valuing it at $ 4.5 billion. The acquisition agreement reached before with Magna was terminated. Upon closure, SSW’s partners will acquire all of Veoneer’s outstanding capital, shortly thereafter sell Arriver’s business to Qualcomm, and retain Veoneer’s Tione-1 supplier business. Arriver’s computer vision, management policy and driving assistance will be incorporated into the Qualcomm Snapdragon Ride ADAS solution.
DOGS to acquire Colorado Engineering, Inc. (CEI), provider of radio frequency (RF) and HPC solutions. Both companies have a strong focus on the space and defense industries. “The combination of RF and an integrated CAES microwave oven and deep manufacturing experience, with advanced CEI technology and digital systems engineering skills, allows us to provide flexible and differentiated solutions to our customers. Together, we are well placed to offer next-generation platforms, ”said Mike Kahn, President and CEO of CAES. CEI was founded in 2003 and is headquartered in Colorado Springs, Colorado. The terms of the deal have not been disclosed.
Cadence revealed 3D-IC platform that integrates planning, implementation and systematic analysis of 3D design. Integrity 3D-IC provides integrated electrothermal, static time analysis and physical verification flows. It also includes 3D exploration streams that take 2D network lists to create multiple 3D stacking scenarios based on user input, automatically selecting the optimal, final 3D ordered configuration. It supports all types of 3D design. “The integrated logical flow memory included in the Cadence Integrity 3D-IC platform enables STA planning, deployment and multi-matrix, which our research teams have demonstrated in multi-core high-performance design,” said Eric Bain, Senior Colleague and Program Director, 3D System Integration. , in Imek. Slight intelligence and SaneChips is also noted using the platform.
Autodesk and Ansis are developing a PCB extension that adds Ansys electromagnetic capabilities to Autodesk Fusion 360. The extension aims to allow rapid design study with real-time PCB analysis.
Ansis and Apple cooperates on a solution to simulate radio frequency (RF) safety tests for developers of Apple’s MagSafe module technology. MagSafe® chargers use magnets in newer PiPhone models to connect to accessories that also have built-in magnets. The companies said the cloud simulation tool eliminates the need for physical prototypes and hardware for RF safety certification and provides developers with streamlined Specific Absorption Rate (SAR) certification.
Synopsis revealed complete HBM3 IP solution, including controller, PHY and IP verification for 2.5D packet systems with multiple matrices. Built on Synopsys’ HBM2E IP, it allows high bandwidth memory up to 921 GB / s. The HBM3 controller’s IP supports a variety of HBM3-based systems and has advanced RAS features that include error correction code, refresh management, and parity. HBM3 PHY IP in 5nm process is available as pre-hardened or configured by the PHY client. It operates at speeds of up to 7200 Mbps per pin and supports up to four active operating states, allowing dynamic frequency scaling, with an optimized micro-boom array to help minimize area. IP for authentication uses natural SystemVerilog UVM and includes memory models for emulation and prototyping.
Rambus debuted Compute Express Link (CXL) 2.0 and PCI Express (PCIe) 5.0 controllers with integrated Integrity and Data Encryption (IDE) modules, which protect against physical attacks on CXL and PCIe connections. IDE modules use 256-bit AES-GCM (Advanced Encryption Standard, Galois / Counter Mode) cryptographic block cipher with symmetric key and have zero latency for CXL.mem and CXL.cache. “Successfully activating models for using CXL in data-intensive applications, such as memory sharing between processors and attached AI accelerators, requires ultra-low latency security,” said Sean Fan, chief operating officer at Rambus.
Comcores unlocked Interlaken IP. Silicone and PHY agnostic implementation of Interlaken Protocol version 1.2, aimed at any ASIC or FPGA technology, it supports up to 2.6Tbps high-speed performance and comes with an integrated layer for media access.
Infineon introduced new flexible and scalable half-bridge power supply module. The car’s 750 V EasyPACK 2B EDT2 can reach a maximum power of up to 50 kW and 230 A depending on the conditions of the inverter. It is designed to simplify module integration and require less space.
Ericsson and PowerLight technology deployed 5G mmWave base radio, which is powered wirelessly. The demonstration of proof of concept uses optical beamforming, which converts electricity into high-intensity light, which is captured and transformed back into base station electricity. The base station was not powered by the street network, only by wireless power, which provided hundreds of watts per hundred meters. “The ability to safely transfer energy over distances without having to connect to the grid eliminates one of the major obstacles we have in building new cellular sites,” said Kevin Zvockel, Head of Networking for Ericsson North America. PowerLight strives to make its technology to provide kilowatts of power for miles away.
A pioneer used a few Infineon components in its solar distribution system, including a discrete CoolSiC MOSFET, EiceDRIVER Compact Gate Driver and CoolMOS P7 power MOSFET. The system allows solar energy to be distributed physically and according to the needs between different households.
Marvel completed its acquisition of innovative. The deal with all shares was valued at $ 1.1 billion. Innovium adds its Ethernet data center switches focused on ultra-low latency, optimized power and high performance to increase Marvell’s data center product portfolio. Marvel too announced that it will offer a new IP address TSMC 3nm process and use of 2.5D technology for chip packing on wafer on substrate (CoWoS). The new 3-nanometer multi-chip platform includes two complementary advanced die-die interfaces: a flexible, extremely short-range interface for connecting multiple arrays on a package pad, and a parallel die-to-death interface with ultra-low power and low latency with high bandwidth density.
Micron announced new SSDs in the data center. Available in seven form factors, the Micron 7400 SSD line ranges from 400GB to 7.68TB and more than doubles the IOP per watt and performance compared to the previous generation. The device offers support for 128 namespaces to increase scalability for virtualized environments such as hyperconverged infrastructure and software-defined storage, and also supports the deployment of the Open Compute Project (OCP) for qualified environments.
Samsung Electronics introduced The open source scalable memory development kit (SMDK), which is specifically designed to support the Compute Express Link (CXL) memory platform. The new software suite supports memory virtualization to allow conventional and CXL-based memory to work together without the need to change system applications.
Manufacturer of quantum computers Calculation of rejections will merger with a special purpose acquisition company The company for acquiring partners Supernova II to be listed on the New York Stock Exchange. Rigeti develops and manufactures hardware for superconducting quantum computers, provides software for their use, and offers access to its computers through the cloud. The company is expected to receive approximately $ 458 million in cash, which includes a fully committed PIPE of more than $ 100 million, direct investment and $ 345 million held in the Supernova II trust account. The funds from the deal will be used for business development and expansion; the company plans to increase its superconducting quantum computers from 80 qubits in 2021, to 1,000 qubits in 2024 and to 4,000 qubits in 2026. Based in Berkeley, California, Rigetti was founded in 2013.
Thalia Design Automation announced changes in management, with founder and former chief technical officer Soumyan Rajagopalan taking over as executive director. Thalia provides a platform for reusing analog and mixed signals.